Semiconductor device

ABSTRACT

The semiconductor device includes a first inverter and a second inverter which is connected thereto in series. Bach of the first and the second inverters includes a p-channel transistor and art n-channel transistor, respectively. The number of projection semiconductor layers each as the active region of the p-channel and the n-channel transistors of the second inverter is smaller than the number of the projection semiconductor layers each as the active region of the p-channel and the n-channel transistors of the first inverter.

CLAIM OF PRIORITY

The present application claims priority from Japanese patent application JP2015-59529 filed on Mar. 23, 2015, the content of which is hereby incorporated by reference into this application.

BACKGROUND

The present invention relates to a semiconductor device which is applicable to a delay inverter circuit for FinFET, for example.

Aiming at suppressing the short channel effect in association with microniration, WO2006/132172 proposes the field effect transistor (hereinafter referred to as fin type field effect transistor, FinFET for short) which is configured to have a projection semiconductor layer projecting upward from a substrate plane, and form a channel region on both planes (both side surfaces) substantially perpendicular at least to the substrate plane of the projection semiconductor layer. The FinFET is produced by forming the three-dimensional structure on the two-dimensional substrate. The gate volume of the FinFET will be larger than that of the planar type transistor so long as the substrate has the same area. As the gate is configured to “envelope” the channel, the resultant channel controllability of the gate is high, and the leak current in the state where the device is in OFF state may be significantly reduced. Therefore, the threshold voltage may be set to be lower, resulting in optimum switching speed and energy consumption. SUMMARY

The present invention provides the delay circuit suitable for the FinFET.

The disclosure of the present invention will be briefly explained as follows.

The semiconductor device includes a first inverter and a second inverter connected thereto in series. Each of the first and the second inverters includes a p-channel transistor and an n-channel transistor, respectively. The number of projection semiconductor layers which constitute active regions of the p-channel and the n-channel transistors of the second inverter is smaller than the number of projection semiconductor layers which constitute active regions of the p-channel and the n-channel transistors of the first inverter.

The above-structured semiconductor device is enabled to constitute the optimum delay circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view for explaining a semiconductor device according to a first embodiment;

FIG. 1B is a circuit diagram for explaining the semiconductor device according to the first embodiment;

FIG. 2 is a plan view for explaining a semiconductor device according to a second embodiment;

FIG. 3A is a plan view for explaining a semiconductor device according to a third embodiment;

FIG. 3B is a circuit diagram for explaining the semiconductor device according to the third embodiment;

FIG. 4A is a plan view for explaining a semiconductor device according to a fourth embodiment;

FIG. 4B is a plan view of an enlarged part of the structure shown in FIG. 4 A;

FIG. 5A is a sectional view taken along line A′-A″ of FIG. 4B;

FIG. 5B is a sectional view taken along line B′-B″ of FIG. 4B;

FIG. 5C is a sectional view taken along line C′-C″ of FIG. 4B;

FIG. 5D is a sectional view taken along line D′-D″ of FIG. 4B;

FIG. 5E is a sectional view taken along line E′-E″ of FIG. 4B;

FIG. 5F is a sectional view taken along line F′-F″ of FIG. 4B;

FIG. 6A is a plan view for explaining a semiconductor device according to a fifth embodiment;

FIG. 6B is a plan view of an enlarged part of the structure shown in FIG. 6A;

FIG. 7A is a plan view for explaining a semiconductor device according to a sixth embodiment;

FIG. 7B is a plan view of an enlarged part of the structure shown in FIG. 7A;

FIG. 8 is a sectional view taken along line G′-G″ of FIG. 7B;

FIG. 9A is a plan view for explaining a semiconductor device according to a seventh embodiment;

FIG. 9B is a plan view of an enlarged part of the structure shown in FIG. 9A;

FIG. 10A is a sectional view taken along line H′-H″ of FIG. 9B

FIG. 10B is a sectional view taken along line I′-I″ of FIG. 9B

FIG. 10 C is a sectional view taken along line J′-J″ of FIG. 9B;

FIG. 11A is a plan view for explaining a semiconductor device according to an eighth embodiment;

FIG. 11B is a plan view of an enlarged part of the structure shown in FIG. 11.A;

FIG. 12A is a sectional view taken along line K′-K″ of FIG. 11B;

FIG. 12B is a sectional view taken along line L′-L″ of FIG. 11B;

FIG. 12C is a sectional view taken along line M′-M″ of FIG. 11B; and

FIG. 13 is a plan view for explaining a semiconductor device according to an aspect of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

An aspect of the present invention will be described together with embodiments referring to the drawings. In the following description the same components are designated with the same codes, and explanations thereof, thus will be omitted. The drawings may be schematically illustrated with respect to width, thickness, configuration and the like of the respective components in comparison with the actual mode for clear understanding. It is to be understood that the description represents one of examples, which is not intended to restrict interpretation of the present invention.

A semiconductor device according to the aspect of the present invention will be described referring to FIG. 13. FIG. 13 is a plan view of the semiconductor device according to the aspect of the present invention.

A semiconductor device 100 according to the aspect of the invention includes a first inverter 110, and a second inverter 120 connected to the first inverter 110 in series.

The first inverter 110 includes a first p-channel transistor 111 p and a first n-channel transistor 111 n. The second inverter 120 includes a second p-channel transistor 121 p and a second n-channel transistor 121 n.

The first p-channel transistor 111 p includes a first active region 12 p, a first gate electrode 13, a first local connection wiring 14 sp, and a second local connection wiring 14 dp. The first active region 12 p is in the form of a projection semiconductor layer, extending along a first (X) direction. The first gate electrode 13 extends along a second (Y) direction. The second local connection wiring 14 sn which extends along the second direction is connected to a drain side of the first active region.

The first n-channel transistor 111 n includes a second active region 12 n, the first gate electrode 13, a third local connection wiring 14 sn, and a fourth local connection wiring 14 dn. The second active region 12 n is in the form of the projection semiconductor layer, extending along the first direction. The third local connection wiring 14 sn extends along the second direction so as to be connected to a source side of the second active region 12 n. The fourth local connection wiring 14 dn extends along the second direction so as to be connected to a drain side of the second active region 12 n.

The second p-channel transistor 121 p includes a third active region 42 p, a second gate electrode 43, a fifth local connection wiring 44 sp, and a sixth local connection wiring 44 dp. The third active region 42 p is in the form of the projection semiconductor layer, extending along the first direction. The second gate electrode 43 extends along the second direction. The fifth local connection wiring 44 sp extends along the second direction so as to be connected to a source side of the third active region 42 p. The sixth local connection wiring 44 dp extends along the second direction so as to be connected to a drain side of the third active region 42 p.

The second n-channel transistor 121 n includes a fourth active region 42 n, the second gate electrode 43, a seventh local connection wiring 44 sn, and an eighth local connection wiring 44 dn. The fourth active region 42 n is in the form of the projection semiconductor layer, extending along the first direction. The seventh local connection wiring 44 sn extends along the second direction so as to be connected to a source side of the fourth active region 42 n. The eighth local connection wiring 44 dn extends along the second direction so as to be connected to a drain side of the fourth active region 42 n.

The number of the third active regions 42 p is smaller than the number of the first active regions 12 p, and the number of the fourth active regions 42 n is smaller than the number of the second active regions 12 n.

The above-structured first and second inverters may constitute the delay circuit.

First Embodiment

The semiconductor device according to a first embodiment will be described referring to FIGS. 1A and 1B. FIG. 1A is a plan view representing structure of the semiconductor device according to the first embodiment. FIG. 1B is a circuit diagram of the semiconductor device according to the first embodiment.

A semiconductor device 100A of the first embodiment is in the form of a delay circuit (buffer) constituted by an inverter circuit for the FinFET. The semiconductor device 100A is formed on a semiconductor substrate such as silicon (Si) through the process after 16 nm FinFET, for example.

As FIG. 1B shows, the semiconductor device 100A is structured by connecting inverters in two stages in series. A p-channel transistor (first p-channel transistor) 11 p of an inverter (first inverter) 10 at the latter stage (output side) includes four active regions (first active regions) 12 p, and a gate electrode (first gate electrode) 13 which crosses those regions. The p-channel transistor 11 p includes a local interconnector (LIC or local connection wiring) 14 sp for connecting four active regions at the source side, which are connected to a first power source metal wiring 16 vd, and an LIC (second local connection wiring) 14 dp for connecting the four active regions at the drain side. The active region 12 p is constituted by a semiconductor layer (projection semiconductor layer) with Fin structure. The LIC is provided because of small width of the projection semiconductor layer in a planar view, which cannot allow formation of a via for connection to the upper layer metal wiring. Those four active regions 12 p extend along X direction each in the strip-like form in a planar view. The gate electrode 13, the LIC (first local connection wiring) 14 sp, and the LIC 14 dp extend along Y direction each in the strip-like form in a planar view. The strip-like form basically has a thin rectangular shape, the respective long and short sides of which are not necessarily linear. Each of four corners of such form does not have to be a right angle, but may be rounded. The n-channel transistor (first n-channel transistor) 11 n of the inverter 10 includes four active regions (second active regions) 12 n, and the gate electrode 13 which crosses those regions. The n-channel transistor 11 n includes the LIC (third local connection wiring) 14 sn for connecting the four active regions at the source side, which are connected to a second power source metal wiring 16 vs, and the LIC (fourth local connection wiring) 14 dn for connecting the four active regions at the drain side. The active region 12 n is constituted by the projection semiconductor layer. The four active regions 12 n extend along X direction each in the strip-like form in a planar view. The gate electrode 13 and an input metal wiring 16 i are connected through a via 15 g, and the LIC 14 dp and an output metal wiring 16 o are connected through a via 15 dp. The LIC 14 dn and the output metal, wiring 16 o are connected through a via 15 dn so that the p-channel transistor 11 p and the n-channel transistor 11 n are connected. The number of the active regions 12 p is not limited to four so long as it is larger than the number of the active regions 22 p. The number of the active regions 12 n is not limited to four so long as it is is larger than the number of the active regions 22 n. The number of the active regions 22 p is not limited to one so long as it is smaller than the number of the active regions 12 p. The number of the active regions 22 n is not limited to one so long as it is smaller than the number of the active regions 12 n.

The p-channel transistor (second p-channel transistor) 21 p of the inverter (second inverter) 20 in the former stage (input side) includes an active region (third active region) 22 p constituted by the projection semiconductor layer, and a gate electrode (second gate electrode) 23 which crosses the active region. The p-channel transistor 21 p includes an LIC (fifth local connection wiring) 24 sp for connecting the source side of the active region 22 p and the first power source metal wiring 16 vd, and an LIC (sixth local connection wiring) 24 dp for connecting the drain side of the active region 22 p and an output metal wiring 26 o. The active region 22 p extends along X direction in the strip-like form in a planar view. The gate electrode 23, the LIC 24 sp, and the LIC 24 dp extend along Y direction each in the strip-like form in a planar view. The n-channel transistor (second n-channel transistor) 21 n of the inverter 20 includes the active region (fourth active region) 22 n constituted by the projection semiconductor layer, and the gate electrode 23 which crosses the active region. The n-channel transistor 21 n includes an LIC (seventh local connection wiring) 24 sn for connecting the source side of the active region 22 n and the second power source metal wiring 16 vs, and an LIC (eighth local connection wiring) 24 dn for connecting the drain side of the active region 22 n and the output metal wiring 26 o. The active region 22 n extends along X direction in the strip-like form in a planar view. The gate electrode 23 and an input metal wiring 26 i are connected through a via 25 g, and the LIC 24 dp and the output metal wiring 26 o are connected through a via 25 dp The LIC 24 dn and the output metal, wiring 26 o are connected through a via 25 dn so that the p-channel transistor 21 p and the n-channel transistor 21 n are connected. A connection metal wiring 16 io connects the output metal wiring 26 o and the input metal wiring 16 i so as to connect the inverters 20 and 10. The output metal wiring 26 o extends along Y direction in the strip-like form in a planar view The semiconductor device 100A includes dummy gate electrodes 13 d each with the same size as the gate electrode 13 in the same layer. The dummy gate electrodes 13 d are provided for uniform density of the gate electrode layer. The potential applied to the first power source metal wiring 16 vd is higher than the one applied to the second power source metal wiring 16 vs.

Each of the p-channel transistor 21 p and the n-channel transistor 21 n has one diffusion region. Each of the p-channel transistor 11 p and the n-channel transistor 11 n has four active regions. The following formulae are established.

Wg2=2×H _(FIN) +W _(FIN)   (1)

Wg1=4×(2×H _(FIN) αW _(FIN))=4×Wg2   (2)

where H_(FIN) denotes the height (fin height) of the projection semiconductor layer which constitutes the active region, W_(FIN) denotes the width (fin width) of the projection semiconductor layer, Wg2 denotes each gate width of the p-channel transistor 21 p and the n-channel transistor 21 n, and Wg1 denotes each gate width of the p-channel transistor 11 p and the n-channel transistor 11 n. The following formula is established.

$\begin{matrix} {\begin{matrix} {{{Wg}\; {1/{Lg}}\; 1} = {4 \times {Wg}\; {2/{Lg}}\; 1}} \\ {= {{4 \times {Wg}\; {2/{Lg}}\; 2} > {{Wg}\; {2/{Lg}}\; 2}}} \end{matrix}\quad} & (3) \end{matrix}$

where Lg2 denotes each gate length (width of the gate electrode 23) of the p-channel transistor 21 p and the n-channel transistor 21 n, and Lg1 denotes each gate width (width of the gate electrode 13) of the p-channel transistor 11 p and the n-channel transistor 11 n, and the relationship of Lg1=Lg2 is established. In other words, the ratio of the gate width to each gate length of the p-channel transistor 21 p and the n-channel transistor 21 n (Wg2/Lg2) becomes smaller than the ratio of each gate width to each gate length of the p-channel transistor 11 p and the n-channel transistor 11 n (Wg1/Lg1).

The width (W_(FIN)) of the active region 12 p in a planar view is defined as d1, and the distance between adjacent active regions 12 p in a planar view is defined as d2. A distance between an end of the active region 12 p at the side proximate to the n-channel transistor 11 n and an end of the LIC 14 dp at the side of the n-channel transistor 11 n in a planar view is defined as d3, and a distance between an end of the active region 12 p at the side proximate to the first power source metal wiring 16 vd, and an end of the LIC 14 dp at the side of the first power source metal wiring 16 vd in a planar view is defined as d4. A distance between an end of the active region 12 p at the side proximate to the n-channel transistor 11 n, and an end of the LIC 14 sp at the side of the n-channel transistor 11 n in a planar view is defined as d3, and a distance between an end of the active region 12 p at the side proximate to the first power source metal wiring 16 vd, and an end of the LIC 14 sp at the side of the first power source metal wiring 16 vd in a planar view is defined as d5.

A width of the active region 12 n in a planar view is defined as d1, and a distance between the adjacent active regions 12 n in a planar view is defined as d2. A distance between an end of the active region 12 n at the side proximate to the p-channel transistor 11 p, and an end of the LIC 14 dn at the side of the p-channel transistor 11 p in a planar view is defined as d3, and a distance between an end of the active region 12 n at the side proximate to the second power source metal wiring 16 vs, and an end of the LIC 14 dn at the side of the second power source metal wiring 16 vs in a planar view is defined as d4. A distance between an end of the active region 12 n at the side proximate to the p-channel transistor 11 p, and an end of the LIC 14 sn at the side of the p-channel transistor 11 p in a planar view is defined as d3, and a distance between an end of the active region 12 n at the side proximate to the second power source metal wiring 16 vs, and an end of the LIC 14 sn at the side of the second power source metal wiring 16 vs in a planar view is defined as d5. A width of the active region 22 p in a planar view is defined as d1, a distance between an end of the active region 22 p and an end of the LIC 24 dp at the side of the n-channel transistor 11 n in a planar view is defined as d6, arid a distance between an end of the active region 22 p and an end of the LIC 24 dp at the side of the first power source metal wiring 16 vd in a planar view is defined as d7. A distance between an end of the active region 22 p and an end of the LIC 24 sp at the side of the n-channel transistor 21 n in a planar view is defined as d8, and a distance between an end of the active region 22 p and an end of the LIC 24 sp at the side of the first power source metal wiring 16 vd in a planar view is defined as d9.

A width of the active region 22 n in a planar view is defined as d1 a distance between an end of the active region 22 n and an end of the LIC 24 dn at the side of the p-channel transistor 11 p in a planar view is defined as d6, and a distance between an end of the active region 22 n and an end of the LIC 24 dn at the side of the second power source raetal wiring 16 vs in a planar view is defined as d7. A distance between an end of the active region 22 n and an end of the LIC 24 sn at the side of the p-channel transistor 21 p in a planar view is defined as d8, and a distance between an end of the active region 22 n and an end of the LIC 24 sn at the side of the second power source metal wiring 16 vs in a planar view is defined as d9.

Each interval between the LIC 14 dp and the LIC 14 dn, and between the LIC 14 sp and the LIC 14 sn is defined as d10.

The active region 22 p is disposed on the same line with the active region 12 p at the side proximate to the first power source metal wiring 16 v along X direction, and the active region 22 n is disposed on the same line with the active region 12 n at the side proximate to the second power source metal wiring 16 vs along X direction. The resultant relationships will be expressed by the following formulae.

Length of LIC 24dp=d7+d1+d6   (4)

Length of LIC 14dp=d4+d1+(N−1) (d1+d2)+d3   (5)

Length of LIC 24sp=d9+d1+d8   (6)

Length of LIC 14sp=d5+d1+(N−1) (d1+d2)+d3   (7)

d3=(d1+d2)/4   (8)s

where N denotes the number of the active regions of the p-channel transistor 11 p and the n-channel transistor 11 n. N=4 is set in the case of the semiconductor device 100A where d6=d3, d7=d4, d8=d3, and d9=d4. For example, the d1 is about 10 nm long, and the d2 is about 40 nm long.

Assuming that a gate pitch (inter-gate-electrode distance+gate length) is defined as d11, the resultant relationship will be expressed by the following formulae. For example, the d11 is approximately 90 nm long.

Ls1=2×d11   (9)

Lg1≤W _(LIC) ≤d11/2   (10)

The semiconductor device 100A is in the form of the delay circuit (buffer) structured by connecting inverters in two stages in series, and configured to minimize the active regions (the number of projection semiconductor layers) of the inverter in the former stage for prolonging the delay time. The delay time may be prolonged by increasing difference in the number of the projection semiconductor layers of the inverters between the former stage and the latter stage because the time taken for charging and discharging the latter stage inverter becomes longer. Preferably, the number of the projection semiconductor layers of the latter stage inverter is maximized if the arrangement allows. This makes it possible to stabilize output signals of the delay circuit. The delay time may be reduced by enlarging the active region of the former stage inverter (the number of the projection semiconductor layers).

Second Embodiment

A semiconductor device according to a second embodiment will be described referring to FIG. 2, which is configured to prolong the delay time longer than the semiconductor device 100A. FIG. 2 is a plan view representing structure of the semiconductor device according to the second embodiment.

Likewise the semiconductor device 100A according to the first embodiment as shown in FIG. 1B, a semiconductor device 100B according to the second embodiment is structured by connecting the inverters in two stages in series. The inverter 10 has the same structure as that of the inverter at the output side of the semiconductor device 100A. An inverter 30 in the former stage (input side) of the semiconductor device 100B is differently structured from the inverter 20 of the semiconductor device 100A. FIG. 2 omits description of the first power source metal wiring 16 vd and vias 15 ap, 25 ap which are connected to the wiring, the second power source metal wiring 16 vs, and vias 15 sn, 25 sn which are connected to the wiring.

Each gate width (Wg2) of a p-channel transistor 31 p and an n-channel transistor 31 n is the same as each gate width (Wg2) of the p-channel transistor 21 p and the n-channel transistor 21 n. However, the gate length (Lg2) of a gate electrode 33 is made longer than the Lg1 so as to prolong the delay time.

In order to prolong the delay time with good area efficiency, the gate length is adjusted to make the thick layout in reference to the minimum processing rule. This may increase the cell size in X direction correspondingly. Assuming that the cell size of the inverter 10 in X direction is defined as Ls1, and the cell size of the inverter 30 in X direction is defined as Ls2, the relationship of Ls2>Ls1 is established. Use of transistors each with different gate length in the same cell may cause dispersion in the delay time due to different characteristics between those transistors.

Third Embodiment

A semiconductor device according to a third embodiment will be described referring to FIGS. 3A and 3B, which employs transistors each with the same gate length for solving the problem of the device according to the second embodiment. FIG. 3A is a plan view representing structure of the semiconductor device according to the third embodiment. FIG. 38 is a circuit diagram of the semiconductor device according to the third embodiment.

As FIG. 3B shows, a semiconductor device 100C according to the third embodiment is structured by connecting inverters in four-stage cascade. The inverter 10 at output side is the same as the one used for the semi conductor device 100A. Each of the inverters 20 in three stages at input side is the same as the one used for the semiconductor device 100A. As each cell size of the inverters 10 and 20 in X direction is defined as Ls1, the cell size of the semiconductor device 100C is expressed as 4×Ls1. FIG. 3A omits description of the first power source metal wiring 16 vd, the vias 15 sp, 25 sp which are connected to the wiring, the second power source metal wiring 16 vs, and the vias 15 sn , 25 sn which are connected to the wiring. The semiconductor device 100C requires more transistors to prolong the delay time, leading to increase in the cell size in X direction.

Fourth Embodiment

A semiconductor device according to a fourth embodiment will be described referring to FIGS. 4A, 4B, and 5A to 5F, which employs long LIC for solving the problems of the device according to the second and the third embodiments. FIG. 4A is a plan view representing structure of the semiconductor device according to the fourth embodiment. FIG. 4B is a plan view of an enlarged part of the structure as shown in FIG. 4A. FIG. 5A is a sectional view taken along line A′-A″ of FIG. 4B. FIG. 5B is a sectional view taken along line B′-B″ of FIG. 4B. FIG. 5C is a sectional view taken along line C′-C″ of FIG. 4B. FIG. 5D is a sectional view taken along line D′-D″ of FIG. 4B. FIG. 5E is a sectional view taken along line E′-E″ of FIG. 4B. FIG. 5F is a sectional view taken along line F′-F″ of FIG. 4B.

Likewise the semiconductor device 100A according to the first embodiment 33 shown in FIG. 1B, a semiconductor device 100D according to the fourth embodiment is structured by connecting inverters in two stages in series. The inverter 10 of the semiconductor device 100D in the latter stage (output side) has the same structure as that of the inverter of the semiconductor device 100A. An inverter (second inverter) 40 of the semiconductor device 100D in the former stage (input side) basically has the same structure as that of the inverter 20 of the semiconductor device 100A except difference in each length of LIC 44 dp, 44 dn, and the output metal wiring 46 o, and each position of vias 45 dp, 45 dn.

A width of an active region 42 p in a planar view is defined as d1, a distance between an end of the active region 42 p and an end of the LIC 44 dp at the side of the n-channel transistor (second n-channel transistor) 41 n in a planar view is defined as d6, and a distance between an end of the active region 42 p and an end of the LIC 44 dp at the side of the first power source metal wiring 16 vd in a planar view is defined as d7. A distance between an end of the active region 42 p and an end of the LIC 44 ap at the side of the n-channel transistor 41 n in a planar view is defined as d8, and a distance between an end of the active region 42 p and an end of the LIC 44 sp at the side of the first power source metal wiring 16 vd in a planar view is defined as d9.

A width of an active region 42 n in a planar view is defined as d1, a distance between an end of the active region 42 n and an end of the LIC 44 dn at the side of the p-channel transistor 41 p in a planar view is defined as d6, and a distance between an end of the active region 42 n and an end of the LIC 44 dn at the side of the second power source metal wiring 16 vs in a planar view is defined as d7. A distance between an end of the active region 42 n and an end of the LIC 44 n at the aide of the p -channel transistor (second p-channel transistor) 41 p in a planar view is defined as d8, and a distance between an end of the active region 42 n and an end of the LIC 44 sn at the side of the second power source metal wiring 16 vs in a planar view is defined as d9.

The active region 42 p is disposed on the same line with the active region 12 p at the side proximate to the first power source metal wiring 16 vd in X direction, and the active region 42 n is disposed on the same line with the active region 12 n at the side proximate to the second power source metal wiring 16 vs in X direction so that, the relationship is expressed by the formulae (4) to (10). In the case of the semiconductor device 1000, the relationships of d7=d4, d9=d5 are established. Furthermore, the LIC 14 dp has the same length as that of the LIC 44 dp, the LIC 14 sp has the same length as that of the LIC 44 sp, the LIC 14 dn has the same length as that of the LIC 44 dn, and the LIC 14 sn has the same length as that of the LIC 44 sn for establishing the following relationships.

d6=(N−1) (d1+d2)+d3   (11)

d8=(N−1) (d1+d2)+d3   (12)

In the case of the semiconductor device 100D, N=4 is set. Accordingly, the d6 becomes longer than the d3, and the d8 becomes longer than the d3, resulting in the length longer than the corresponding part of the semiconductor device 100A.

The number of the active regions 12 p is not limited to four so long as it is larger than the number of the active regions 42 p. The number of the active regions 12 n is not limited to four so long as it is larger than the number of the active regions 42 n. The number of the active regions 42 p is not limited to one so long as it is smaller than the number of the active regions 12 p. The number of the active regions 42 n is not limited to one so long as it is smaller than the number of the active regions 12 n.

FIG. 4B is a plan view representing a part of the n-channel transistor 41 n of the inverter 40 of the semiconductor device 100D at the input side. The structure of the aforementioned part will be described referring to FIGS. 5A to 5F. As each of the p-channel transistor 41 p of the inverter 40 at the input side, the n-channel transistor 11 n and the p-channel transistor 11 p of the inverter 10 at the output side has the similar structure, explanations of such structure will be omitted.

As FIGS. 5A, 5D, 5E, 5F show, the active region 42 n as the semiconductor layer partially projects from a semiconductor substrate 1 while piercing through an insulating film 2. In other words, the insulating film 2 constituting an element isolation region is formed on the semiconductor substrate 1 around the active region 42 n. As FIG. 5D shows, a gate insulating film 3 is formed on both side surfaces, and upper surface of the active region 42 n. Assuming that height and width of the active region 42 n in contact with the gate insulating film 3 are defined as H_(FIN) and W_(FIN), respectively, the relationship of H_(FIN)>W_(FIN) is established. For example, the H_(FIN) may be 30 nm long, and the W_(FIN) may be 10 nm wide, approximately. Referring to FIGS. 5A and 5D, the gate electrodes 43, 13 are formed in contact with the upper and side surfaces of the gate insulating film 3. Referring to FIGS. 5B and 5C, the gate electrode 43 is formed on the insulating film 2. Referring to FIGS. 5A to 5C, side walls 4 each as the insulating film are formed at both sides of the gate electrode 43 in an extending direction. Referring to FIGS. 5A to 5F, an interlayer insulating film 5 is formed ever the active region 42 n, the insulating film 2, the gate electrode 43, and the side walls 4.

As FIGS. 5A, 5B, 5C and 5F show, the LIC 44 sn and 44 dn each made of the first metal film are formed on the upper and side surfaces of the active region 42 n at the source and drain sides, and above the insulating film 2. In this way, the LIC 44 sn is connected to the active region 42 n at the source side, and the LIC 44 dn is connected to the active region 42 n at the drain side. The first metal film may be made from tungsten (W), for example.

As FIGS. 5A to 5F show, an interlayer insulating film 6 is formed on the interlayer insulating film 5, and the LIC 44 sn, 44 dn. As FIGS. 5C and 5F show, the via 45 dn as the second metal film is formed on the LIC 44 dn. The via 45 dn is connected to the LIC 44 dn, and the via 45 sn is connected to the LIC 44 sn.

As FIGS. 5A to 5F show, an interlayer insulating film 7 is formed on the interlayer insulating film 6 and the via 45 dn. Referring to FIGS. 5C to 5F, the output metal wiring 46 o as the third metal film and the second power source metal wiring 16 vs are formed on the via 45 dn and the inter layer insulating film 6. The vie 45 dn is connected to the output metal wiring 46 o, and the via 45 sn is connected to the second power source metal wiring 16 vs. The third metal film may be made from copper (Cu), for example.

The semiconductor device 100D is exemplified by the buffer structured by connecting the inverters in two stages in series, and configured to minimize the active regions (the number of projection semiconductor layers) of the inverter in the former stage for the purpose of prolonging the delay time. The LIC of the inverter at the input side with the part in parallel with the gate electrode extending not only to the portion on the projection semiconductor layer but also to the portion without the projection semiconductor layer. As parasitic capacitance Cpe exists in the part where the LIC is disposed in parallel with the gate electrode, the parasitic capacitance may be Increased by elongating the parallel driving distance. Therefore, unlike the second embodiment requiring change in the gate length or the third embodiment requiring increase in the number of inverters to be connected, this embodiment is capable of prolonging the delay time while keeping the same cell area. The inverter capacitance at the input side is doubled compared with the case where the LIC is disposed only on the projection semiconductor layer. Assuming that the delay time in the case of the structure having the LIC disposed only on the projection semiconductor layer is defined as Ta, the delay time of the inverter at the input side may be expressed by 2×Ta. Assuming that the delay time of the inverter at the output side is defined as Tb, the delay time in the case of the inverters in two stages may be expressed by 2×Ta+Tb. That is, it is possible to establish the delay time corresponding to Ta while keeping the same area. As the inverter at the input side has small number of Fins, the relationship of Ta>Tb is established. The use of the layout as described in the fourth embodiment allows the delay time corresponding to Ta to be prolonged by 1.5 or more times.

Furthermore, as the transistors employed for this embodiment are less than those employed for the third embodiment, less leak, current is generated, which allows reduction in power consumption more than the case with the same delay time.

Fifth Embodiment

A semiconductor device according to a fifth embodiment will be described referring to FIGS. 6A and 6B, which has the same delay time as that of the fourth embodiment. FIG. 6A is a plan view representing structure of the delay circuit according to the fifth embodiment. FIG. 6B is a plan view of an enlarged part of the structure shown in FIG. 6A.

A semiconductor device 100E according to the fifth embodiment is substantially the same as the semiconductor device according to the fourth embodiment except that the arrangement of the active regions of an inverter (second inverter) 50 at the input side is different. Sectional views taken along lines A′-A″, B′-B″, C′-C″ of FIG. 6B are the same as those shown in FIGS. 5A, SB, SC, respectively.

A width of an active region 52 p in a planar view is defined as d1, a distance between an end of the active region 52 p and an end of the LIC 44 dp at the side of the n-channel transistor 51 n in a planar view is defined as d6, and a distance between an end of the active region 52 p and an end of the LIC 44 dp at the aide of the first power source metal wiring 16 vd in a planar view is defined as d7. A distance between an end of the active region 52 p and an end of the LIC 44 sp at the side of the n-channel transistor (second n-channel transistor) 51 n in a planar view is defined as d8, and a distance between an end of the active region 52 p and an end of the LIC 44 sp at the side of the first power source metal wiring 16 vd in a planar view is defined as d9.

A width of the active region 52 n in a planar view is defined as d1, a distance between an end of the active region 52 n and an end of the LIC 44 dn at the side of the p-channel transistor 51 p in a planar view is defined as d6, and a distance between an end of the active region 52 n and an end of the LIC 44 dn at the side of the second power source metal wiring 16 vs in a planar view is defined as d7. A distance between an end of the active region 52 n and an end of the LIC 44 sn at the side of the p-channel transistor (second p-channel transistor) 51 p in a planar view is defined as d8, and a distance between an end of the active region 52 n and an end of the LIC 44 sn at the side of the second power source metal wiring 16 vs in a planar view is defined as d9.

The active region 52 p is disposed on the same line with the active region 12 p at the side farthest to the first power source metal wiring 16 vd in X direction, and the active region 52 n is disposed on the same line with the active region 12 n at the side farthest to the second power source metal wiring 16 vs in X direction so that the relationship is expressed by the formulae (4) to (10). In the case of the semiconductor device 100E, the relationships of d6=d3, d8=d3 are established. Furthermore, the LIC 14 dp has the same length as that of the LIC 44 dp, the LIC 14 sp has the same length as that of the LIC 44 sp, the LIC 14 dn has the same length as that of the LIC 44 dn, and the LIC 14 sn has the same length as that of the LIC 44 sn for establishing the following relationships.

d7=(N−1l) (d1+d2)+d4   (13)

d9=(N−1) (d1+d2)+d5   (14)

In the case of the semiconductor device 100E, N=4 is set. Accordingly, the d7 becomes longer than the d4, and the d9 becomes longer than the d5, resulting in the length longer than the corresponding part of the semiconductor device 100A.

The number of the active regions 12 p is not limited to four so long as it is larger than the number of the active regions 52 p. The number of the active regions 12 n is not limited to four so long as it is larger than the number of the active regions 52 n. The number of the active regions 52 p is not limited to one so long as it is smaller than the number of the active regions 12 p. The number of the active regions 52 n is not limited to one so long as it is smaller than the number of the active regions 12 n.

In spite of positional change of the active regions of the inverter at the input side, the delay time may be prolonged because of increase in the parasitic capacitance likewise the fourth embodiment.

The active region 52 p does not have to be disposed on the same line with the active region 12 p at the side farthest to the first power source metal wiring 16 vd in X direction. It may be disposed at the position between the active regions 12 p at the sides farthest and proximate to the first power source metal wiring 16 vd. The active region 52 n does not have to be disposed on the same line with the active region 12 n at the side farthest to the second power source metal wiring 16 vs in X direction. It may be disposed at the position between the active regions 12 n at the sides farthest and proximate to the second power source metal wiring 16 vs.

Sixth Embodiment

A semiconductor device according to a sixth embodiment will be described referring to FIGS. 7A, 7B, 8, which has the delay time shorter than the cases of the fourth and the fifth embodiments. FIG. 7A is a plan view representing structure of the semiconductor device according to the sixth embodiment. FIG. 7B is a plan view of an enlarged part of the structure shown in FIG. 7A. FIG. 8 is a sectional view taken along line G′-G″ of FIG. 7B.

A semiconductor device 100F according to the sixth embodiment is basically the same as the semiconductor device according to the first embodiment except that the LIC to be connected to the drain side active region of an inverter (second inverter) 60 at the input side has the different length. In the state where the length of the LIC is variable, sectional views taken along lines A′-A″ and C′-C″ of FIG. 7B are analogical to those shown in FIGS. 5A and 5C, respectively.

A width of the active region 42 p in a planar view is defined as d1, a distance between an end of the active region 42 p and an end of an LIC 64 dp at the side of an n-channel transistor 61 n in a planar view is defined as d6, and a distance between an end of the active region 42 p and an end of the LIC 64 dp at the side of the first power source metal wiring 16 vd in a planar view is defined as d7. A distance between an end of the active region 42 p and an end of the LIC 44 sp at the side of the n-channel transistor (second n-channel transistor) 61 n in a planar view is defined as d8, and a distance between an end of the active region 42 p and an end of the LIC 44 sp at the side of the first power source metal wiring 16 vd in a planar view is defined as d9.

A width of the active region 42 n in a planar view is defined as d1, a distance between an end of the active region 42 n and an end of the LIC 64 dn at the side of the p-channel transistor 41 p in a planar view is defined as d6, and a distance between an end of the active region 42 n and an end of the LIC 64 dn at the side of the second power source metal wiring 16 vs in a planar view is defined as d7. A distance between an end of the active region 42 n and an end of the LIC 44 sn at the side of the p-channel transistor (second p-channel transistor) 61 p in a planar view is defined as d8, and a distance between an end of the active region 42 n and an end of the LIC 44 sn at the side of the second power source metal wiring 16 vs in a planar view is defined as d9.

The active region 42 p is disposed on the same line with the active region 12 p at the side proximate to the first power source metal wiring 16 vd in X direction, and the active region 42 n is disposed on the same line with the active region 12 n at the side proximate to the second power source metal wiring 16 vs in X direction so that the relationship is expressed by the formulae (4) to (10). In the case of the semiconductor device 100F, the relationships of d6=d3, d7=d4, d9=d5 are established. Furthermore, the LIC 14 sp has the same length as that of the LIC 44 sp, and the LIC 14 sn has the same length as that of the LIC 44 sn for establishing the following relationship.

d8=(N−1) (d1+d2)+d3   (12)

In the case of the semiconductor 100D, N=4 is set. Accordingly, the d8 becomes longer than the d3, resulting in the length longer than the corresponding part of the semiconductor device 100A.

The number of the active regions 12 p is not limited to four so long as it is larger than the number of the active regions 42 p. The number of the active regions 12 n is not limited to four so long as it is larger than the number of the active regions 42 n. The number of the active regions 42 p is not limited to one so long as it is smaller than the number of the active regions 12 p. The number of the active regions 42 n is not limited to one so long as it is smaller than the number of the active regions 12 n.

Consequently, as FIGS. 7B and 8 show, the LIC in parallel with most part of the gate electrode 43 at one side hardly exists. Then the parasitic capacitance (CPe) between the gate electrode and the LIC is reduced. The delay time of the CMOS inverter 60 at the input side is expressed as Ta+Ta/2, which is prolonged by Ta/2. Compared with the fourth embodiment, the delay time of the inverter at the input side is reduced by Ta/2.

According to the first, fourth, sixth embodiments, values of the d6 and d8 may be in the following range.

d3≤d6≤(N−1) (d1+d2)+d3   (15)

d3≤d8≤(N−1) (d1+d2)+d3   (16)

In the aforementioned range, d6=d8=d3 is established in the first embodiment, and d6=d8=(N−1) (d1+d2)+d3 is established in the fourth embodiment. The delay time of the inverter at the input side may be adjusted in the range of (1.5-2) Ta by regulating the length of the LIC at the drain side of the active region. It is possible to reduce the length (d8) of the LIC to be connected to the source side of the active region. The delay time of the inverter at the input side may be adjusted in the range of (1-1.5) Ta by regulating the length of the LIC at the source side of the active region. The delay time of the inverter at the input side may be adjusted in the range of (1-2) Ta by regulating each length of the LIC both at the drain and source sides of the active region. The change in the LIC length as described above makes it possible to adjust the delay time while keeping the same area of the inverter.

Seventh Embodiment

A semiconductor device according to a seventh embodiment will be described referring to FIGS. 9A, 9B, and 10A to 10C. FIG. 9A is a plan view representing structure of the semiconductor device according to the seventh embodiment. FIG. 9B is a plan view of an enlarged part of the structure shown in FIG. 9A. FIG. 10 A is a sectional view taken along line H′-H″ of FIG. 9B. FIG. 10B is a sectional view taken along line I′-I″ of FIG. 9B. FIG. 10C is a sectional view taken along line J′-J″ of FIG. 9B.

A semiconductor device 100G according to the seventh embodiment is basically the same as the semiconductor device 100D according to the fourth embodiment except the metal wiring as the upper layer of the LIC of an inverter (second Inverter) 70 at the input side, and arrangement of the vias. In other words, values of d1 to d11 of the semiconductor device 100G are the same as those of the semiconductor device 100D.

An output metal wiring 760 is disposed so as to be layered on the LIC 44 dp and the LIC 44 dn. The output raetai wiring 76 o is connected to the LIC 44 dp through a plurality of vias 45 dp (three vias in the drawing), and is connected to the LIC 44 dn through a plurality of vias 45 dn (three vias in the drawing). A metal wiring 76 sp to be connected to the first power source metal wiring 16 vd is disposed so as to be layered on the LIC 44 sp, and a metal wiring 76 sn to be connected to the second power source metal wiring 16 vs is disposed so as to be layered on the LIC 44 sn. The LIC 44 sp is connected to the metal wiring 76 sp through a plurality of vias 45 sp (four vias in the drawing), and the LIC 44 sn is connected to the metal wiring 76 sn through a plurality of vias 45 dn (four vias in the drawing).

As FIGS. 10A, 10B, 10C show, the parasitic capacitance is newly generated between the metal wiring and the gate electrode, the via and the gate electrode, and the metal wirings, respectively. The resultant parasitic capacitance becomes greater than that of the fourth embodiment, thus prolonging the delay time. Increase in the number of the vias will further add the parasitic capacitance to the via capacity (between the via and the gate electrode, between the vias, between the via and the metal wiring) . This makes it possible to prolong the delay time. This embodiment is configured to increase the parasitic capacitance by adding the metal wirings and the vias to the structure according to the fourth embodiment. However, the aforementioned feature may be applied to the first, fifth, sixth, and eighth embodiments.

Eighth Embodiment

A semiconductor device according to an eighth embodiment will be described referring to FIGS. 11A, 11B, and 12A to 12C. FIG. 11A is a plan view representing structure of the semiconductor device according to the eighth embodiment. FIG. 11B is a plan view of an enlarged part of the structure shown in FIG. 11A. FIG. 12A is a sectional view taken along line K′-K″ of FIG. 11B. FIG. 12B is a sectional view taken along line L′-L″ of FIG. 11B. FIG. 12C is a sectional view taken along line M′-M″ of FIG. 11B.

Likewise the semiconductor device 100A according to the first embodiment as shown in FIG. 1B, a semiconductor device 100H according to the eighth embodiment is structured by connecting the inverters in two stages in series. The inverter 10 of the semiconductor device 100H at the output side has substantially the same structure as that of the inverter of the semiconductor device 100A at the output side, and an inverter (second inverter) 80 of the semiconductor device 100H is configured to share the source side LIC of the inverter at the output side.

The p-channel transistor 11 p of the inverter 10 at the output side includes the active regions 12 p constituted by the semiconductor layer with three Fin structures, an active region (first active region) 82 p as the semiconductor layer with single Fin structure, and the gate electrode 13 which crosses those regions. The p-channel transistor 11 p includes the LIC 14 sp for connecting four active regions at the source side, which are connected to the first power source metal wiring 16 vd, and the LIC 14 dp for connecting four active regions at the drain side. The n-channel transistor 11 n of the inverter 10 at the output side includes active regions 12 n with three-Fin structure, and the gate electrode which crosses the active regions. The n-channel transistor 11 n includes the LIC 14 sn for connecting four active regions at the source side, which are connected to the second power source metal wiring 16 vs, and an active region (second active region) 82 n as the semiconductor layer with the single Fin structure, and the LIC 14 dnfor connecting four active regions at the drain side. The number of the active regions 82 p is not limited to one, but may be set to, for example, two so long as it is smaller than the number of the active regions of the p-channel transistor 11 p. In the case where the p-channel transistor 11 p has four active regions, and two active regions 82 p, the number of the active regions 12 p becomes two. The number of the active regions 82 n is not limited to one, but may be set to, for example, two so long as it is smaller than the number of the active regions of the n-channel transistor 11 n. In the case where the n-channel transistor 11 n has four active regions, and two active regions 82 n, the number of the active regions 12 n becomes two.

A p-channel transistor (second p-channel transistor) 81 p of the inverter 80 at the input side includes an active region (third active region) 82 p, and a gate electrode 83 which crosses the active region. The p-channel transistor 81 p includes the LIC 14 sp for connecting the source side of the active region 82 p and the first power source metal wiring 16 vd, and an LIC 84 dp for connecting the drain side of the active region 82 p and an output metal wiring 86 o. The active region of the p-channel transistor 81 p is connected to one of the active regions of the p-channel transistor 11 p. In the case of two active regions 82 p of the p-channel transistor 81 p, they are connected to the respective active regions of the p-channel transistor 11 p.

An n-channel transistor (second n-channel transistor) 81 n of the inverter 80 at the input side includes an active region (fourth active region) 82 n, and the gate electrode 83 which crosses the active region. The n-channel transistor 81 n includes an LIC 14 sn for connecting the source side of the active region 82 n and the second power supply metal wiring 16 vs, and an LIC 84 dn for connecting the drain side of the active region 82 n and the output metal wiring 86 o. The active region of the n-channel transistor 81 n is connected to one of the active regions of the n-channel transistor 11 n. In the case of two active regions 82 n of the n-channel transistor 81 n, they are connected to the respective active regions of the n-channel transistor 11 n.

The gate electrode 83 and an input metal wiring 861 are connected through a via 85 g, the LIC 84 dp and the output metal wiring 86 o are connected through a via 85 dp, the LIC 84 dn and the output metal wiring 86 o are connected through a via 85 dn so that the p-channel transistor 81 p and the n-channel transistor 81 n are connected The output metal wiring 86 o and the input metal wiring 16 i are connected through the connection metal wiring 16 io so that the input side inverter 80 and the output side inverter 10 are connected. The semiconductor device 100H includes dummy gate electrodes 13 d each with the same size as the gate electrode on the same layer, which is kept unconnected. The number of the dummy gate electrodes is smaller than the number of those electrodes in other embodiments by one. The potential applied to the first power source metal wiring 16 vd is higher than the one applied to the second power source metal wiring 16 vs.

Values of d1 to d7, d10 and d11 of the semiconductor device 100H are the same as those of the semiconductor device 100D. As the source side LICs are shared by the inverters 10 and 80, d and d9 do not exist.

As FIGS. 12A to 12C show, likewise each parasitic capacitance between the gate electrode 13 and the LIC 14 dn, the gate electrode 13 and the LIC 14 sn, the gate electrode 83 and the via 15 dn, and the gate electrode 13 and the output metal wiring 16 o, each parasitic capacitance between the gate electrode 83 and the LIC 84 dn, the gate electrode 83 and the LIC 14 sn, the gate electrode 83 and the via 85 dn, and the gate electrode 83 and the output metal wiring 86 o will be added so that the delay time of the inverter 80 is substantially the same as that of the fourth embodiment.

The active region 82 p does not have to be disposed at the side proximate to the first power source metal wiring 16 vd, but may be disposed at the position between the active regions 12 p at the sides farthest and proximate to the first power source metal wiring 16 vd. The active region 82 n does not have to be disposed at the side proximate to the second power source metal wiring 16 vs, but may be disposed at the position between the active regions 12 n at the sides farthest and proximate to the second power source metal wiring 16 vs. Each number of the vias 85 dp and 85 dn is not limited to one, but a plurality of vias may be provided as described in the seventh embodiment.

The semiconductor device 100H is configured that the LICs to be connected to the first and the second power sources are shared by the inverters 10 and 80. This makes it possible to reduce the distance in X direction, thus decreasing the cell area.

The present invention has been described, taking the embodiments as examples. However, it is to be understood that the present invention is not limited to those embodiments, but may be modified into various forms within the scope of the present invention. 

1-19. (canceled)
 20. A semiconductor device comprising: a semiconductor substrate including a main surface; an insulating film formed on the main surface in a direction perpendicular to the main surface; a first interlayer insulating film formed on the insulating film in the direction perpendicular to the main surface; a second interlayer insulating film formed on the first interlayer insulating film in the direction perpendicular to the main surface; a third interlayer insulating film formed on the second interlayer insulating film in the direction perpendicular to the main surface; a plurality of first and second projection semiconductor layers projecting from the main surface through the insulating film, extended in a first direction in a plan view of the main surface, and formed in the first interlayer insulating film; third and fourth projection semiconductor layers projecting from the main surface through the insulating film, extended in the first direction in the plan view, and formed in the first interlayer insulating film; a first inverter comprised of a first p-channel transistor and a first n-channel transistor, the first p-channel transistor including: a first gate electrode extended in a second direction crossing the first direction in the plan view, formed in the first interlayer insulating film, and formed on the plurality of first projection semiconductor layers via a first gate insulating film; a plurality of first source regions each formed in one of the plurality of first projection semiconductor layers on one side of the first gate electrode; and a plurality of first drain regions each formed in one of the plurality of first projection semiconductor layers on the other side of the first gate electrode, and the first n-channel transistor including: the first gate electrode also formed on the plurality of second projection semiconductor layers; a plurality of second source regions each formed in one of the plurality of second projection semiconductor layers on one side of the first gate electrode; and a plurality of second drain regions each formed in one of the plurality of second projection semiconductor layers on the other side of the first gate electrode; and a second inverter comprised of a second p-channel transistor and a second n-channel transistor; the second p-channel transistor including: a second gate electrode extended in the second direction in the plan view, formed in the first interlayer insulating film, and formed on the third projection semiconductor layer via a second gate insulating film; a third source region formed in the third projection semiconductor layer on one side of the second gate electrode; and a third drain region formed in the third projection semiconductor layer on the other side of the second gate electrode; and the second n-channel transistor including: the second gate electrode also formed on the fourth projection semiconductor layer; a fourth source region formed in the fourth projection semiconductor layer on one side of the second gate electrode; and a fourth drain region formed in the fourth projection semiconductor layer on the other side of the second gate electrode; a first local connection wiring formed in the first interlayer film, electrically connected to the plurality of first source regions and the third source region, and extended in the second direction in the plan view; a second local connection wiring formed in the first interlayer film, electrically connected to the plurality of first drain regions, separated from the first local connection wiring, and extended in the second direction in the plan view; a third local connection wiring formed in the first interlayer film, electrically connected to the plurality of second source regions and the fourth source region, and extended in the second direction in the plan view; a fourth local connection wiring formed in the first interlayer film, electrically connected to the plurality of second drain regions, separated from the third local connection wiring, and extended in the second direction in the plan view; a fifth local connection wiring formed in the first interlayer film, electrically connected to the third drain region, separated from the first local connection wiring, and extended in the second direction in the plan view; and a sixth local connection wiring formed in the first interlayer film, electrically connected to the fourth source region, separated from the third local connection wiring, and extended in the second direction in the plan view, wherein the number of the third projection semiconductor layer is smaller than the number of the plurality of first projection semiconductor layers, wherein the number of the fourth projection semiconductor layer is smaller than the number of the plurality of second projection semiconductor layers, wherein the second local connection wiring is electrically connected to the fourth local connection through an output metal wiring of the first inverter formed in the third interlayer insulating film, wherein the fifth local connection wiring is electrically connected to the first gate electrode through a first output metal wiring of the second inverter formed in the third interlayer insulating film and a first connection metal wiring formed in the third interlayer insulating film, wherein the sixth local connection wiring is electrically connected to the first gate electrode through a second output metal wiring of the second inverter formed in the third interlayer insulating film and a second connection metal wiring formed in the third interlayer insulating film, wherein the second local connection wiring and the output metal wiring of the first inverter are electrically connected to each other through a first via penetrating the second interlayer insulating film, wherein the fourth local connection wiring and the output metal wiring of the first inverter are electrically connected to each other through a second via penetrating the second interlayer insulating film, wherein the fifth local connection wiring is electrically connected to the first output metal wiring of the second inverter through a third via penetrating the second interlayer insulating film, and wherein the sixth local connection wiring is electrically connected to the second output metal wiring of the second inverter through a fourth via penetrating the second interlayer insulating film.
 21. The semiconductor device according to claim 20, further comprising: a first power supply metal wiring electrically connected to the first local connection wiring, and located in the third interlayer insulating film; and a second power supply metal wiring electrically connected to the third local connection wiring and located in the third interlayer insulating film.
 22. The semiconductor device according to claim 20, further comprising: a first dummy gate wiring disposed on the other side of the fist gate electrode, the second local connection wiring, and the fourth local connection wiring, in the plan view, wherein the first dummy gate wiring is electrically insulated.
 23. The semiconductor device according to claim 22, further comprising: a second dummy gate wiring disposed on the other side of the second gate electrode, the fifth local connection wiring, and the sixth local connection wiring, in the plan view, wherein the second dummy gate wiring is electrically insulated.
 24. The semiconductor device according to claim 22, wherein the third projection semiconductor layer is one of the plurality of first projection semiconductor layers, and wherein the fourth projection semiconductor layer is one of the plurality of second projection semiconductor layers.
 25. The semiconductor device according to claim 24, wherein other ones of the plurality of first projection semiconductor layers and other ones of the plurality of second projection semiconductor layers are in contact with the second gate wiring.
 26. A semiconductor device comprising: a first inverter; and a second inverter connected in series with the first inverter, wherein the first inverter comprises: a first p-channel transistor; and a first n-channel transistor, wherein the second inverter comprises: a second p-channel transistor; and a second n-channel transistor, wherein the first p-channel transistor comprises: a plurality of first sources extended in a first direction and formed in a plurality of first projection semiconductor layers constituting active regions, respectively; a plurality of first drains formed in each of the plurality of first projection semiconductor layers; a plurality of first gates extended in a second direction perpendicular to the first direction, and formed of a first gate wiring so as to cover each of the plurality of first projection semiconductor layers, wherein each of the plurality of first sources are electrically connected to a first local connection wiring extended in the second direction, wherein each of the plurality of first drains are electrically connected to a second local connection wiring extended in the second direction and separated from the first local connection wiring, wherein the first gate wiring is disposed between the first local connection wiring and the second local connection wiring in plan view, wherein the first n-channel transistor comprises: a plurality of second sources extended in the first direction and formed in a plurality of second projection semiconductor layers constituting active regions respectively; a plurality of second drains formed in each of the plurality of second projection semiconductor layers; a plurality of second gates formed of the first gate wiring so as to cover each of the plurality of second projection semiconductor layers too, wherein each of the plurality of second sources are connected to a third local connection wiring extended in the second direction, wherein each of the plurality of second drains are electrically connected to a fourth local connection wiring extended in the second direction and separated from the third local connection wiring, wherein the first gate wiring is further disposed between the third local connection wiring and the fourth local connection wiring in plan view, wherein the second p-channel transistor comprises: a third source extended in the first direction, and formed in the third projection semiconductor layer and constituting an active region; a third drain formed in the third projection semiconductor layer; a third gate extended in the second direction, and formed of a second gate wiring so as to cover the third projection semiconductor layer, wherein the first local connection wiring is also connected to the third source electrically, wherein the third drain is extended in the second direction, and connected to a fifth local connection wiring separated from the first local connection wiring, wherein the second gate wiring is disposed between the first local connection wiring and the fifth local connection wiring in plan view, wherein the second n-channel transistor comprises: a fourth source extended in the first direction, and formed in the fourth projection semiconductor layer constituting an active region; a fourth drain formed in the fourth projection semiconductor layer; a fourth gate formed of the second gate wiring so as to cover the fourth projecting semiconductor layer too, wherein the third local interconnection wiring is also connected to the fourth source, wherein the fourth drain is electrically connected to a sixth local connection wiring extended in the second direction, and separated from the third local connection wiring, wherein the second gate wiring is further disposed between the third local connection wiring and the sixth local connection wiring in plan view, wherein the fifth local connection wiring is electrically connected to the first gate wiring through a first output metal wiring of the second inverter and a first connection metal wiring, wherein the sixth local connection wiring is electrically connected to the first gate wiring through a second output metal wiring of the second inverter and a second connection metal wiring, wherein the second local connection wiring is electrically connected to the fourth local connection wiring through an output metal wiring of the first inverter, wherein the first gate wiring, the second gate wiring, the first local connection wiring, the second local connection wiring, the third local connection wiring, the fourth local connection wiring, the fifth local connection wiring, and the sixth local connection wiring are provided in a first interlayer insulating film, wherein the second local connection wiring and the output metal wiring of the first inverter are connected to each other through a first via penetrating a second interlayer insulating film located on the first interlayer insulating film, wherein the fourth local connection wiring and the output metal wiring of the first inverter are connected to each other through a second via penetrating the second interlayer insulating film, wherein the fifth local connection wiring and the first output metal wiring of the second inverter are connected to each other through a third via penetrating the second interlayer insulating film, wherein the sixth local connection wiring and the second output metal wiring of the second inverter are connected to each other through a fourth via penetrating the second interlayer insulating film, wherein the first output metal wiring of the second inverter, the second output metal wiring of the second inverter, and the output metal wiring of the first inverter are located in a third interlayer insulating film located on the second interlayer insulating film, wherein the number of the third projection semiconductor layer constituting the second p-channel transistor is smaller than the number of the plurality of first projection semiconductor layers constituting the first p-channel transistor, and wherein the number of the fourth projection semiconductor layer constituting the second n-channel transistor is smaller than the number of the plurality of second projection semiconductor layers constituting the first n-channel transistor.
 27. The semiconductor device according to claim 26, further comprising: a first power supply metal wiring electrically connected to the first local connection wiring, and located in the third interlayer insulating film; and a third power supply metal wiring electrically connected to the third local connection wiring and located in the third interlayer insulating film.
 28. The semiconductor device according to claim 26, wherein the first output metal wiring and the second output metal wiring are located in the third interlayer insulating film.
 29. The semiconductor device according to claim 26, further comprising: a first dummy gate wiring disposed adjacent to the second local connection wiring and the fourth local connection wiring in plan view, wherein the first dummy gate wiring is electrically insulated.
 30. The semiconductor device according to claim 29, further comprising: a second dummy gate wiring disposed adjacent to the fifth local connection wiring and the sixth local connection wiring in plan view, wherein the second dummy gate wiring is electrically insulated.
 31. The semiconductor device according to claim 29, wherein the third projection semiconductor layer is one of the plurality of first projection semiconductor layers, and wherein the fourth projection semiconductor layer is one of the plurality of second projection semiconductor layers.
 32. The semiconductor device according to claim 31, wherein other ones of the plurality of first projection semiconductor layers and other ones of the plurality of second projection semiconductor layers are in contact with the second gate wiring. 